Cooling Methods for High-Power Electronic Systems

2011
Andrei Blinov, Dmitri Vinnikov, Tonu Lehtla

Thermal management is a crucial step in the design of power electronic applications, especially railroad traction and automotive systems. Mass/size parameters, robustness and reliability of the power electronic system greatly depend on the cooling system type and performance. This paper presents an approximate parameter estimation of the thermal management system required as well as different commercially available cooling solutions. Advantages and drawbacks of different designs ranging from simple passive heatsinks to complex evaporative systems are discussed.

Keywords
Electronic packaging thermal management, electronics cooling, power dissipation, power semiconductor devices
DOI
10.2478/v10144-011-0014-x

Blinov, A., Vinnikov, D., Lehtla, T. Cooling Methods for High-Power Electronic Systems. Power and Electrical Engineering. Vol.29, 2011, pp.79-86. ISSN 1407-7345. Available from: doi:10.2478/v10144-011-0014-x

Publication language
English (en)