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Publikācija: Fungal Degradation of Wood Plastic Composites Made with Thermally Modified Wood Residues

Publication Type Full-text conference paper published in conference proceedings indexed in SCOPUS or WOS database
Funding for basic activity National Research Programme
Defending: ,
Publication language English (en)
Title in original language Fungal Degradation of Wood Plastic Composites Made with Thermally Modified Wood Residues
Field of research 2. Engineering and technology
Sub-field of research 2.5 Materials engineering
Research platform None
Authors Edgars Kuka
Dace Cīrule
Jānis Kajaks
Anna Janberga
Ingeborga Andersone
Bruno Andersons
Keywords wood plastic composites, thermally modified wood, thermo-hydro treatment, biodegradation, fungal degradation.
Abstract Wood plastic composites (WPC) are mainly used as an outdoor material, so durability against fungal decay is one of the factors that should be analyzed and if necessary improved. WPC are susceptible to biodegradation, although these materials have limited water absorption because of the wood fiber encapsulation in polymer matrix. In the study two different water pretreatment methods (short-term and long-term) were used to ensure appropriate water content for fungal growth. Also in the paper thermally modified wood (different regimes) fiber influence on WPC fungal resistance is investigated. The results showed that long-term water pretreated WPC specimens had more suitable conditions for fungal degradation that led to higher weight loss. The results which were related to thermally modified wood fibers showed, that WPC with thermally modified wood fibers had improved resistance against fungi. Thermal modification regimes had an effect on WPC durability as well
DOI: 10.4028/www.scientific.net/KEM.721.8
Hyperlink: https://www.scientific.net/KEM.721.8 
Reference Kuka, E., Cīrule, D., Kajaks, J., Janberga, A., Andersone, I., Andersons, B. Fungal Degradation of Wood Plastic Composites Made with Thermally Modified Wood Residues. In: Key Engineering Materials, Latvia, Riga, 3-4 November, 2017. Riga: Trans Tech Publications, Switzerland, 2017, pp.8-12. ISSN 1013-9826. e-ISSN 1662-9795. Available from: doi:10.4028/www.scientific.net/KEM.721.8
Additional information Citation count:
ID 22929