Transient Analysis of AC and DC Microgrid with Effective of SFCL
            
            2018 IEEE 59th International Scientific Conference on Power and Electrical Engineering of Riga Technical University (RTUCON 2018)
            2018
            
        
                Mahmoud Aref,
        
                Amir Abdelmeneam,
        
                Vladislav Oboskalov,
        
                Anatolijs Mahņitko,
        
                Aleksandrs Gavrilovs
        
    
            
            
            Due to the increasing penetration level of microgrids (MGs), it becomes a critical issue for MGs to help sustaining power system stability. Therefore, this paper is aimed at investigating comparison between transient analysis AC and DC Microgrid connected to the grid in case of using Superconducting Fault current limiter (SFCL) at the connection point of Microgrid and grid. When the three-phase-to-ground fault is applied at connection point of Microgrid and grid, the SFCL minimized the oscillating currents and the active and reactive power of AC and DC microgrid to range 20-30%. The transient analysis of AC microgrid is better than DC microgrid except the values currents and the active and reactive power are very high during the fault. The time required to recover pre-fault values of AC microgrid (0.1 sec) is less than those time of DC microgrid (3 sec).
            
            
            
                Keywords
                PV. microgrid, SFCL, grid
            
            
                DOI
                10.1109/RTUCON.2018.8659839
            
            
                Hyperlink
                https://ieeexplore.ieee.org/document/8659839
            
            
            Aref, M., Abdelmeneam, A., Oboskalov, V., Mahņitko, A., Gavrilovs, A. Transient Analysis of AC and DC Microgrid with Effective of SFCL. In: 2018 IEEE 59th International Scientific Conference on Power and Electrical Engineering of Riga Technical University (RTUCON 2018), Latvia, Riga, 12-14 November, 2018. Piscataway: IEEE, 2018, pp.200-205. ISBN 978-1-5386-6904-4. e-ISBN 978-1-5386-6903-7. Available from: doi:10.1109/RTUCON.2018.8659839
            
                Publication language
                English (en)