Bluetooth Low Energy Throughput in Densely Deployed Radio Environment
            
            2019 23rd International Conference Electronics
            2019
            
        
                Armands Ancāns,
        
                Juris Ormanis,
        
                Ričards Cacurs,
        
                Modris Greitāns,
        
                Elise Saoutieff,
        
                Adrien Faucorr,
        
                Sébastien Boisseau
        
    
            
            
            Bluetooth Low Energy (BLE) is a promising 2.4 GHz technology for Body Area Networks (BAN) in health care and lifestyle applications. However, the global increase of wireless devices using the crowded spectrum in the 2.4 GHz frequency band can create coexistence issues. This work studies the performance of BLE in environments with multiple BLE devices. An experimental setup consisting of 10 BLE nodes is used to measure BLE application throughput with different connection parameters and under different interference sources, such as other BLE devices and WiFi. The results quantify the decrease of the application throughput and the influence of BLE connection parameters in the experimental settings, as well as suggest parameter values suitable for densely deployed environments.
            
            
            
                Keywords
                Throughput, Bluetooth, Protocols, Wireless fidelity, Sensors, Interference, Wireless sensor networks
            
            
                DOI
                10.1109/ELECTRONICS.2019.8765577
            
            
                Hyperlink
                https://ieeexplore.ieee.org/document/8765577
            
            
            Ancāns, A., Ormanis, J., Cacurs, R., Greitāns, M., Saoutieff, E., Faucorr, A., Boisseau, S. Bluetooth Low Energy Throughput in Densely Deployed Radio Environment. In: 2019 23rd International Conference Electronics, Lithuania, Palanga, 17-19 June, 2019. Piscataway: IEEE, 2019, pp.1-5. ISBN 978-1-7281-2210-6. e-ISBN 978-1-7281-2209-0. Available from: doi:10.1109/ELECTRONICS.2019.8765577
            
                Publication language
                English (en)