A new process for the removal of copper(II) ions from hydrochloric acid solutions by liquid membranes containing di(2-ethylhexyl)phosphoric acid with tri-n-octylamine additives under electrodialysis conditions with cathodic metal electrodeposition is presented. The effects of hydrochloric acid concentration and copper(II) concentration in the feed solution, composition of the organic liquid membrane and a cathode aqueous solution, as well as current density of electrodialysis and electrode material on the rate of extraction and electrodeposition of metal ions have been studied. It was shown that almost complete (96 - 100%) removal of copper (II) ions by the liquid membranes from the feed solution containing 0.01 M CuCl2 was achieved in 0.5 - 3.0 h of electrodialysis and was accompanied by a sharp rise in voltage in the galvanostatic mode of operation. The maximum obtained back extraction degree of copper(II) into the cathode solution is 94%, and the maximum electrodeposition degree is 74%. Dense, bright or matte, well adhered to the electrode cathode copper deposits were obtained during electrodeposition from dilute solutions of sulfuric, hydrochloric, perchloric, nitric and acetic acids.