Mission Profile-Based Electro-Thermal Model of Robotic Manufacturing Application

2021 23rd European Conference on Power Electronics and Applications (EPE'21 ECCE Europe): Conference Proceedings 2021
Oskars Bormanis, Leonīds Ribickis

This paper presents a developed IGBT junction temperature estimation model of a 6-axis industrial robot drive inverter. The interface between the robot program code and the thermal model is introduced. The main novelty is the evaluation of thermal stress as a result of the robot movement analysis. Future development and application suggestions are discussed

Keywords
Reliability, Mission profile, Lifetime, Robotics, Industrial application
Hyperlink
https://ieeexplore.ieee.org/document/9570547

Bormanis, O., Ribickis, L. Mission Profile-Based Electro-Thermal Model of Robotic Manufacturing Application. In: 2021 23rd European Conference on Power Electronics and Applications (EPE'21 ECCE Europe): Conference Proceedings, Netherlands, online, 6-10 September, 2021. Piscataway: IEEE, 2021, pp.1757-1762. ISBN 978-1-6654-3384-6. e-ISBN 978-9-0758-1537-5.

Publication language
English (en)