Study on a Metal Closet Based Wireless Power Transfer System for Smart Suit Charging
2023 Workshop on Microwave Theory and Technology in Wireless Communications (MTTW 2023): Proceedings 2023
Romāns Kušņins, Dmitrijs Pikuļins, Jānis Eidaks, Sergejs Tjukovs, Artūrs Āboltiņš

This paper investigates a metal closet-based wireless power transfer system designed to ensure the wireless charging of batteries incorporated into a smart suit. The closet walls are made of steel, and the dimensions are such that several modes with commensurate amplitudes are excited simultaneously. The fields inside the closet are excited by a sine wave source at an operating frequency of 865.5 MHz, which belongs to the standard sub-GHz ISM band. Several receiving and transmitting antenna configurations are examined, including the one involving a classical dipole antenna printed on an FR-4 substrate acting as the transmitter. The receiving dipole antenna is embedded into a cotton suit model. Additionally, two configurations with single and two Yagi-like antennas are studied. The WPT system power transfer efficiency is estimated by means of commercially available software Ansys HFSS. The simulation results obtained for different antenna configurations are compared to show their advantages and shortcomings. The results show that the use of Yagi-like antennas at both the transmitting and the receiving ends results in the highest efficiency reaching 65% and improves the field uniformity inside the closet, thus relaxing the requirement for precise suit placement.


Keywords
Smart suit charging, wireless power transfer, Yagi-like antenna, field uniformity.
DOI
10.1109/MTTW59774.2023.10320034
Hyperlink
https://ieeexplore.ieee.org/abstract/document/10320034

Kušņins, R., Pikuļins, D., Eidaks, J., Tjukovs, S., Āboltiņš, A. Study on a Metal Closet Based Wireless Power Transfer System for Smart Suit Charging. In: 2023 Workshop on Microwave Theory and Technology in Wireless Communications (MTTW 2023): Proceedings, Latvia, Riga, 4-6 October, 2023. Piscataway: IEEE, 2023, pp.56-61. ISBN 979-8-3503-9350-7. e-ISBN 979-8-3503-9349-1. Available from: doi:10.1109/MTTW59774.2023.10320034

Publication language
English (en)
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