Analysis of Specificity of Ecological Insulation Material Thermal Parameters
MATEC Web of Conferences. Vol.251: 6th International Scientific Conference "Integration, Partnership and Innovation in Construction Science and Education" (IPICSE-2018) 2018
Baiba Gaujēna, Jeļena Tihana, Vladislavs Agapovs

This paper is devoted to analysis of insulation materials quality and characteristics, method for the determination of thermal conductivity coefficient and the influence of various factors on the thermal conductivity coefficient. The paper summarizes the estimated process consumption of thermal energy. The research is defined experimental hemp fiber-sheaves insulation plates manufactured in Latvia further specified actual parameter and quality water absorption; thickness changes; drying process; thermal conductivity coefficient; thermal conductivity coefficient depending from moisture. Research is made using experimental hemp fiber-sheaves insulation pattern manufactured in Latvia – plates in size 300 x 300 mm. In research totally are used three hemp fiber-sheaves pattern series with different substance and extrusion modes. Each series consist from four plate with different thickness. As result of research is determined hemp fiber-sheaves insulation pattern Water absorption, dynamics of Drying process, Thickness changes, Thermal conductivity coefficient and Thermal conductivity coefficient depending from moisture.


Keywords
eco material, thermal insualtion
DOI
10.1051/matecconf/201825101011
Hyperlink
https://www.matec-conferences.org/articles/matecconf/abs/2018/110/matecconf_ipicse2018_01011/matecconf_ipicse2018_01011.html

Gaujēna, B., Tihana, J., Agapovs, V. Analysis of Specificity of Ecological Insulation Material Thermal Parameters. In: MATEC Web of Conferences. Vol.251: 6th International Scientific Conference "Integration, Partnership and Innovation in Construction Science and Education" (IPICSE-2018), Russia, Moscow, 14-16 November, 2018. Les Ulis: EDP Sciences, 2018, Article number 01011. e-ISSN 2261-236X. Available from: doi:10.1051/matecconf/201825101011

Publication language
English (en)
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