Residual Stress in Moisture Sensitive Lamina
Seventeenth International Conference "Mechanics of Composite Materials" (MCM - 2012): Book of Abstracts 2012
Jānis Šliseris, Kārlis Rocēns

The moisture sensitive materials are commonly used in load bearing or covering structures. One of the most popular material in this class of material is wood. Plywood is very common wood material. The plywood elements could be manufactured with symmetrical or unsymmetrical macro-structure with respect to mid-surface. The plywood sheet with unsymmetrical macro-structure obtains curved shape (negative Gaussian curvature) because of orthotropic moisture expansion properties of veneer. The unsymmetrical macro-structure could be used to create a new manufacturing technology (there could be used a standard manufacturing equipment that are used in manufacturing of flat plywood sheets) of curved plywood sheets. A several questions arise according to this kind of sheets. The environment moisture conditions are time dependent and therefore the shape of the sheet is also time-dependent. Significant residual stresses arise when the sheet is curved with moisture difference. The plywood viscous-elastic-plastic properties contribute the change of stress-deformation and shape. The behaviour of plywood sheet with unsymmetrical structure is numerically simulated. The simulation is done by solving coupled moisture diffusion, temperature conductive and stress-deformation problems. Deformations and displacements are large and therefore geometrically nonlinear problem are solved [1]. From a material constitutive model point of view, the material model presented in this paper is composed of five deformation mechanisms which provide an additive decomposition of strain into elastic response, hygroexpansion, viscoelastic creep, recoverable mechanosorption and mechanosorptive irrecoverable creep [2,3,4]. The moisture diffusion in transversal direction of plywood sheet is analyzed using Fick`s law [5]. Temperature conduction is analyzed by Fourier's law. The results of numerical simulation are verified by results of physical experiment. There are obtained the moisture diffusion coefficient in transversal direction of plywood by physical experiment. The results showed that the relaxation of residual stress produce a decrease of curvature of 3-ply sheet more than 20 %. The moisture diffusion kinetics of plywood is different comparing to the same density wood.


Atslēgas vārdi
Residual stress, unsimetric plywood lamina, thermal treatment, diffusion cofficients
Hipersaite
http://www.pmi.lv/Assets/Files/AbstractBookMCM2012.pdf#page=199

Šliseris, J., Rocēns, K. Residual Stress in Moisture Sensitive Lamina. No: Seventeenth International Conference "Mechanics of Composite Materials" (MCM - 2012): Book of Abstracts, Latvija, Jūrmala, 28. Maijs-1. Jūn., 2012. Riga: Institute of Polymer Mechanics. University of Latvia, 2012, 199.-199.lpp.

Publikācijas valoda
English (en)
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