Nanoindentation Response Analysis of Thin Film Substrates-I: Strain Gradient-Divergence Approach

Latvian Journal of Physics and Technical Sciences 2017
Uldis Kanders, Kārlis Kanders

Nanoindentation is a widely-used method for sensitive exploration of the mechanical properties of micromechanical systems. We derive a simple empirical analysis technique to extract stress-strain field (SSF) gradient and divergence representations from nanoindentation data sets. Using this approach, local SSF gradients and structural heterogeneities can be discovered to obtain more detail about the sample’s microstructure, thus enhancing the analytic capacity of the nanoindentation technique. We demonstrate the application of the SSF gradient-divergence analysis approach to nanoindentation measurements of bulk silicon.

Atslēgas vārdi
elastic-plastic deformation, nanoindentation, strain gradient plasticity, stress-strain field, true hardness, true elastic modulus.
DOI
10.1515/lpts-2017-0007
Hipersaite
https://content.sciendo.com/view/journals/lpts/54/1/article-p66.xml

Kanders, U., Kanders, K. Nanoindentation Response Analysis of Thin Film Substrates-I: Strain Gradient-Divergence Approach. Latvian Journal of Physics and Technical Sciences, 2017, Vol.54, Iss.1, 66.-76.lpp. ISSN 0868-8257. Pieejams: doi:10.1515/lpts-2017-0007

Publikācijas valoda
English (en)