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Publikācija: Analysis of Specificity of Ecological Insulation Material Thermal Parameters

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Publikācijas valoda English (en)
Nosaukums oriģinālvalodā Analysis of Specificity of Ecological Insulation Material Thermal Parameters
Pētniecības nozare 2. Inženierzinātnes un tehnoloģijas
Pētniecības apakšnozare 2.1. Būvniecības un transporta inženierzinātnes
Pētniecības platforma Neviena
Autori Baiba Gaujēna
Jeļena Tihana
Vladislavs Agapovs
Atslēgas vārdi eco material, thermal insualtion
Anotācija This paper is devoted to analysis of insulation materials quality and characteristics, method for the determination of thermal conductivity coefficient and the influence of various factors on the thermal conductivity coefficient. The paper summarizes the estimated process consumption of thermal energy. The research is defined experimental hemp fiber-sheaves insulation plates manufactured in Latvia further specified actual parameter and quality water absorption; thickness changes; drying process; thermal conductivity coefficient; thermal conductivity coefficient depending from moisture. Research is made using experimental hemp fiber-sheaves insulation pattern manufactured in Latvia – plates in size 300 x 300 mm. In research totally are used three hemp fiber-sheaves pattern series with different substance and extrusion modes. Each series consist from four plate with different thickness. As result of research is determined hemp fiber-sheaves insulation pattern Water absorption, dynamics of Drying process, Thickness changes, Thermal conductivity coefficient and Thermal conductivity coefficient depending from moisture.
DOI: 10.1051/matecconf/201825101011
Hipersaite: https://www.matec-conferences.org/articles/matecconf/abs/2018/110/matecconf_ipicse2018_01011/matecconf_ipicse2018_01011.html 
Atsauce Gaujēna, B., Tihana, J., Agapovs, V. Analysis of Specificity of Ecological Insulation Material Thermal Parameters. No: MATEC Web of Conferences, Krievija, Moscow, 14.-16. novembris, 2018. -: EDP Sciences, 2018, 1.-9.lpp. e-ISSN 2261-236X. Pieejams: doi:10.1051/matecconf/201825101011
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ID 28417